A combined electrolyte for anodizing and copper plating of aluminum and its alloys

The formulation of an effective combined electrolyte for anodizing and copper plating of aluminum and its alloys, characterized by decreased concentration of harmful components (sulfuric acid, copper sulfate), was developed. To obtain copper deposits of finely crystalline structure, introduction of fluorides into the electrolyte was suggested. The optimum operation conditions for the electrolyte were determined. The electroplated copper coatings exhibit high adhesion to the aluminum support without additional heat treatment, which allows considerable reduction of the process time, especially when depositing multilayered coatings, and saving of expendable materials.