Experimental Investigation on Hybrid Technology of Ultrasonic Vibration Assisted Chemo-Mechanical Grinding (CMG) Silicon Wafer

For the final finishing of the substrate surface, Chemo-mechanical polishing (CMP) is often utilized. Those processes are able to offer a great sur-face roughness, but sacrifice profile accuracy. On the other hand, Chemo-mechanical grinding (CMG) is potentially emerging defect-free machining process which combines the advantages of CMP. In order to simultaneously achieve high surface quality and high profile accuracy, CMG process has been applied into machining of large size quartz glass substrates for photomask use. In this paper, based on the characteristics of higher machining efficiency and higher surface quality of ultrasonic vibration machining, a new ultrasonic vibration assisted CMG of silicon wafer hybrid technique is achieved by designing elliptical vibrator with longitudinal mode and bending mode. The experimental results show that under the elliptic ultrasonic vibration assistance, the surface roughness is decreased significantly, the surface quality is improved obviously, and moreover caused little or even doesn’t lead to the surface damage.