薄脆饼
半导体器件制造
集成电路
蚀刻(微加工)
平版印刷术
工程物理
CMOS芯片
超大规模集成
半导体器件建模
半导体
材料科学
掺杂剂
工程类
纳米技术
计算机科学
电子工程
电气工程
光电子学
兴奋剂
图层(电子)
作者
J.D. Plummer,Michael Deal,Peter B. Griffin
摘要
(NOTE: Chapters 3-11 include an Introduction, Historical Development and Basic Concepts, Manufacturing Methods and Equipment, Measurement Methods, Models and Simulation, Limits and Future Trends in Technologies and Models, Summary of Key Ideas, References, and Problems.) 1. Introduction and Historical Perspective. Introduction. Integrated Circuits and the Planar Process-Key Inventions That Made It All Possible. Semiconductors. Semiconductor Devices. Semiconductor Circuit Families. Modern Scientific Discovery-Experiments, Theory and Computer Simulation. The Plan for This Book. 2. Modern CMOS Technology. CMOS Process Flow. 3. Crystal Growth, Wafer Fabrication and Basic Properties of Silicon Wafers. 4. Semiconductor Manufacturing- Clean Rooms, Wafer Cleaning and Gettering. 5. Lithography. 6. Thermal Oxidation and the Si/SiO2 Interface. 7. Dopant Diffusion. 8. Ion Implantation. 9. Thin Film Deposition. 10. Etching. 11. Backend Technology.
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