Nanoporous Copper Films by Additive-Controlled Electrodeposition: CO2 Reduction Catalysis

Electrodeposition from plating baths containing 3,5-diamino-1,2,4-triazole (DAT) as an inhibitor gives Cu films exhibiting high surface area and high CO 2 reduction activities. By changes in the pH and deposition current density, the morphologies of the Cu films are varied to exhibit wire, dot, and amorphous structures. Among these Cu films, the CuDAT-wire samples exhibit the best CO 2 reduction activities activity with a Faradaic efficiency (FE) for C 2 H 4 product formation reaching 40% at −0.5 V vs RHE, a FE for C 2 H 5 OH formation reaching 20% at −0.5 V vs RHE, and a mass activity for CO 2 reduction at −0.7 V vs RHE of ∼700 A/g.