A novel reinforcement learning framework for disassembly sequence planning using Q-learning technique optimized using an enhanced simulated annealing algorithm

强化学习 模拟退火 增强学习 计算机科学 序列(生物学) 算法 人工智能 数学优化 数学 化学 生物化学
作者
Mirothali Chand,Chandrasekar Ravi
出处
期刊:Artificial intelligence for engineering design, analysis and manufacturing [Cambridge University Press]
卷期号:38 被引量:3
标识
DOI:10.1017/s0890060424000039
摘要

Abstract The increase in Electrical and Electronic Equipment (EEE) usage in various sectors has given rise to repair and maintenance units. Disassembly of parts requires proper planning, which is done by the Disassembly Sequence Planning (DSP) process. Since the manual disassembly process has various time and labor restrictions, it requires proper planning. Effective disassembly planning methods can encourage the reuse and recycling sector, resulting in reduction of raw-materials mining. An efficient DSP can lower the time and cost consumption. To address the challenges in DSP, this research introduces an innovative framework based on Q-Learning (QL) within the domain of Reinforcement Learning (RL). Furthermore, an Enhanced Simulated Annealing (ESA) algorithm is introduced to improve the exploration and exploitation balance in the proposed RL framework. The proposed framework is extensively evaluated against state-of-the-art frameworks and benchmark algorithms using a diverse set of eight products as test cases. The findings reveal that the proposed framework outperforms benchmark algorithms and state-of-the-art frameworks in terms of time consumption, memory consumption, and solution optimality. Specifically, for complex large products, the proposed technique achieves a remarkable minimum reduction of 60% in time consumption and 30% in memory usage compared to other state-of-the-art techniques. Additionally, qualitative analysis demonstrates that the proposed approach generates sequences with high fitness values, indicating more stable and less time-consuming disassembles. The utilization of this framework allows for the realization of various real-world disassembly applications, thereby making a significant contribution to sustainable practices in EEE industries.

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