Development of Shape Memory Epoxy Resin Film With Controllable Response Temperature and Multiple Response Shapes

ABSTRACT To regulate the mechanical and thermal properties of epoxy resin (Ep) and achieve controllability of its shape memory thermal response, this work involves the physical modification of Ep using polyethylene glycol (PEG), leading to the development of shape memory Ep/PEG (EpP) films. As the PEG content increases, EpP gradually transitions from rigid to flexible. Notably, the breaking strain of EpP‐30 with 30% PEG content increased by 27.19% compared to EpP‐0 without PEG. The thermal properties of EpP are also modulated by the PEG content, with the glass transition temperature (T g ) decreasing as the PEG content increases. Specifically, the T g of EpP‐30 is reduced by 33.44°C compared to EpP‐0. The developed EpP exhibits excellent shape memory performance, and its thermal response temperature can be adjusted through PEG content. Furthermore, the EpP developed demonstrates dual and triple‐shape memory functions. In summary, this work achieves the regulation of the mechanical and thermal properties of EpP through the physical modification of Ep with PEG, successfully developing a shape memory EpP with controllable thermal response temperatures and capabilities for dual and triple responses.