材料科学
基质(水族馆)
微电子
拉伤
薄膜
氧化物
联轴节(管道)
复合材料
蛋白质丝
光电子学
纳米技术
衬底耦合
硅
表面改性
变形(气象学)
压力(语言学)
应变工程
作者
Elliot Kisiel,Alexandre Pofelski,Pavel Salev,Erbin Qiu,Spencer A. Reisbick,Chuhang Liu,Andreas Glatz,Ishwor Poudyal,Wei He,Rourav Basak,Kaan Yay,Junjie Li,Umeshkumar Patel,Zhan Zhang,Arndt Last,Yimei Zhu,Iván K. Schuller,Z. Islam,Alex Frañó
出处
期刊:Science
[American Association for the Advancement of Science]
日期:2026-06-18
卷期号:: eadt9347-eadt9347
标识
DOI:10.1126/science.adt9347
摘要
In film-substrate systems, the substrate role is often considered to be limited to providing static mechanical constraints. Dynamic film-substrate interactions when a structural change in the film modifies the substrate are generally disregarded. Using combined X-ray and electron microscopies, we observed that the electrically induced filament in a VO 2 film created strong asymmetric strain in the underlying Al 2 O 3 substate. This asymmetric substrate strain fed back into the film and defined the filament expansion direction, revealing the importance of film-substrate dynamic interactions in determining film functionality. Furthermore, the strain imprint propagated at least tens of microns deep into the substrate, exceeding the film thickness more than 200 times, potentially enabling substrate functionalization as an active mechanical coupling media in 3D-integrated microelectronics architectures.
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