材料科学
硅
铝
激光器
基质(水族馆)
胶粘剂
粘附
箔法
激光束焊接
光电子学
焊接
金属键合
复合材料
半导体
氮化物
金属
冶金
光学
图层(电子)
地质学
物理
海洋学
作者
Oliver John,Jan Paschen,Angela De Rose,Bernd Steinhauser,Gernot Emanuel,Andreas A. Brand,Jan Nekarda
出处
期刊:Procedia CIRP
[Elsevier BV]
日期:2020-01-01
卷期号:94: 863-868
被引量:11
标识
DOI:10.1016/j.procir.2020.09.109
摘要
We present the design, implementation and optimization of laser metal bonding (LMB), a new approach for joining thin aluminum foils and back surfaces of solar cells with a focus on low impact on the semiconductor and good adhesion. After gaining deep insights into laser-material interaction using finite difference simulations, we succeeded in establishing an expulsion free laser process that can be tuned from non-ablative bonding, which leaves the substrate largely intact, to welding, which produces highly adhesive joints. Experiments were conducted on a number of substrates, showing the correlation between damage and adhesion at different process parameters.
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