激光器
材料科学
光学
晶片切割
激光烧蚀
激光加工
沟槽
烧蚀
薄脆饼
光电子学
纳秒
纳米技术
激光束
航空航天工程
工程类
物理
图层(电子)
作者
Sedao,Alan J. Conneely,George T. O'Connor,Tom Glynn
出处
期刊:International Congress on Applications of Lasers & Electro-Optics
日期:2007-01-01
摘要
We report on pulsed laser ablation for dicing/scribing monocrystalline silicon with a frequency tripled DPSS Q-switched nanosecond laser (355nm, AVIA, Coherent). Using a Galvanometer scanhead, a laser beam (repetition rate 30kHz, 143µJ per pulse maximum) was focused down to a 30µm diameter spot on silicon wafer and scanned in single-line mode. The trenches were machined by applying different number of laser scan passes and different laser powers. The cross-section and the side-wall of the trenches were examined using optical and scanning electron microscopes. The laser machining throughput was evaluated by measuring the trench depth and the results show as the trench deepens with repetitive scans the effective ablation rate decreased and maximum depth of 500µm was achieved (aspect ratio 17 approximately). The debris generation and transport is known to be critical in optimising throughput of laser ablative processes. Study of the debris reveals that instead of being removed from the trench part of the debris generated from laser ablation re-deposits in the trench and on the side-walls and forms a recast layer. The formation of such features narrow the open space inside the trenches, which made laser beam delivery and debris transport more difficult.We report on pulsed laser ablation for dicing/scribing monocrystalline silicon with a frequency tripled DPSS Q-switched nanosecond laser (355nm, AVIA, Coherent). Using a Galvanometer scanhead, a laser beam (repetition rate 30kHz, 143µJ per pulse maximum) was focused down to a 30µm diameter spot on silicon wafer and scanned in single-line mode. The trenches were machined by applying different number of laser scan passes and different laser powers. The cross-section and the side-wall of the trenches were examined using optical and scanning electron microscopes. The laser machining throughput was evaluated by measuring the trench depth and the results show as the trench deepens with repetitive scans the effective ablation rate decreased and maximum depth of 500µm was achieved (aspect ratio 17 approximately). The debris generation and transport is known to be critical in optimising throughput of laser ablative processes. Study of the debris reveals that instead of being removed from the trench part of the deb...
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