On the Change in the Form and Parameters of Silicon Compression Curves under Temperature and Electric Current Impacts

Abstract Uniaxial compression of n-type silicon under joint impact of temperature and constant electric current revealed a significant increase in its plasticity in comparison with the deformation performed only at high temperatures. The electrical conductivity of n-Si samples is found to increase with a rise in plastic deformation. The surface microstructures of deformed samples are studied, and possible explanation of the observed effects is proposed.