材料科学
极限抗拉强度
复合材料
复合数
聚二甲基硅氧烷
环氧树脂
丝绸
模数
可伸缩电子设备
透射率
抗撕裂性
数码产品
光电子学
物理化学
化学
作者
Zongpu Xu,Mingrui Wu,Weiwei Gao,Hao Bai
标识
DOI:10.1002/adma.202002695
摘要
Abstract Flexible and transparent substrates play a fundamental role as a mechanical support in advanced electronic devices. However, commonly used polymer films, such as polydimethylsiloxane, show low tear resistance because of their crack sensitivity. Herein, inspired by the excellent mechanical robustness of the skin and its fibrous structure, an epoxy‐resin‐based composite with a flat silk cocoon as a reinforcing fiber network is fabricated. With only 1 wt% of silk fiber, the tensile strength and modulus of the as‐prepared composite film are considerably increased by 300% and 612% compared to those of pure resin, while still maintaining flexibility and transparency. More importantly, the composite shows remarkable tear resistance: without fracture after ≈30 000 tensile cycles. The potential application of such transparent composite films as mechanically robust substrates for flexible electronics is also demonstrated. In addition, this study represents a bioinspired strategy to construct high‐performance functional composite materials.
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