电容器
材料科学
聚焦离子束
金属绝缘体金属
光电子学
电子线路
电气工程
断层(地质)
集成电路
电压
电子工程
离子
工程类
物理
地质学
地震学
量子力学
出处
期刊:International Symposium on the Physical and Failure Analysis of Integrated Circuits
日期:2020-07-20
卷期号:3: 1-4
被引量:2
标识
DOI:10.1109/ipfa49335.2020.9261067
摘要
Metal-Insulator-Metal (MIM) capacitor arrays are commonly found in mixed-signal power electronic integrated circuits. Defect localization to a single MIM capacitor plate in the array often involves topside micro- probing fault isolation and Passive Voltage Contrast (PVC) analysis. These methods can be destructive, involve significant sample preparation time and challenging without a proper topside fault isolation tool. In this paper, a different method will be presented for isolating a single MIM capacitor plate from the array through circuit editing using Focused-Ion Beam (FIB).
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