Modularized batch production of 12-inch transition metal dichalcogenides by local element supply

薄脆饼 材料科学 半导体 纳米技术 单层 光电子学
作者
Guodong Xue,Xin Sui,Peng Yin,Ziqi Zhou,Xiuzhen Li,Yang Cheng,Quanlin Guo,Shuai Zhang,Yao Wen,Yonggang Zuo,Chong Zhao,Muhong Wu,Peng Gao,Qunyang Li,Jun He,Enge Wang,Guangyu Zhang,Can Liu,Kaihui Liu
出处
期刊:Science Bulletin [Elsevier BV]
卷期号:68 (14): 1514-1521 被引量:69
标识
DOI:10.1016/j.scib.2023.06.037
摘要

Two-dimensional (2D) transition metal dichalcogenides (TMDs) are regarded as pivotal semiconductor candidates for next-generation devices due to their atomic-scale thickness, high carrier mobility and ultrafast charge transfer. In analog to the traditional semiconductor industry, batch production of wafer-scale TMDs is the prerequisite to proceeding with their integrated circuits evolution. However, the production capacity of TMD wafers is typically constrained to a single and small piece per batch (mainly ranging from 2 to 4 inches), due to the stringent conditions required for effective mass transport of multiple precursors during growth. Here we developed a modularized growth strategy for batch production of wafer-scale TMDs, enabling the fabrication of 2-inch wafers (15 pieces per batch) up to a record-large size 12-inch wafers (3 pieces per batch). Each module, comprising a self-sufficient local precursor supply unit for robust individual TMD wafer growth, is vertically stacked with others to form an integrated array and thus a batch growth. Comprehensive characterization techniques, including optical spectroscopy, electron microscopy, and transport measurements unambiguously illustrate the high-crystallinity and the large-area uniformity of as-prepared monolayer films. Furthermore, these modularized units demonstrate versatility by enabling the conversion of as-produced wafer-scale MoS2 into various structures, such as Janus structures of MoSSe, alloy compounds of MoS2(1-x)Se2x, and in-plane heterostructures of MoS2-MoSe2. This methodology showcases high-quality and high-yield wafer output and potentially enables the seamless transition from lab-scale to industrial-scale 2D semiconductor complementary to silicon technology.
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