Vertically aligned and conformal BN-coated carbon fiber to achieve enhanced thermal conductivity and electrical insulation of a thermal interface material

Due to excellent thermal conductivity, high aspect ratio, and low density, mesophase pitch-based carbon fibers (MPCFs) are highly desired in electronic packaging. However, their thermal conductivity is hard to present in the polymer matrix because of the disordered stacking and low filling. Moreover, few researches are focused on the enhancement of the electrical insulation performance for MPCFs. Herein, we report vertically aligned and insulating boron nitride (BN) coated carbon fiber (CF) powders as significant fillers for polymer composites, endowing markedly improved thermal conductivity and electrical insulation. The high-quality BN coating layer on the surface of the CF is produced by a cooling precipitation method and high-temperature treatment with ingenious use of solubility properties, exhibiting a conformal, dense, and highly crystalline structure. This preparation method overcomes the limitations of coating thickness and particle agglomeration, resulting in a 31-fold enhancement of the electrical resistivity of the CF powders. After orientation treatment in a silicone rubber matrix, such CF@BN-filled pads exhibit good thermal conductivity, significantly improved insulation performance, and excellent mechanical properties. Among them, the optimized pad achieves a thermal conductivity of 12.06 W m−1 K−1, a volume resistivity of 50 × 108 Ω cm and a breakdown voltage of 3100 V mm−1, exceptional flexibility, and a favorable compression ratio (@45 psi) of 41.7 %. This work provides unique insights into constructing carbon fiber fillers as well as the preparation of high thermal conductivity composites, thereby expanding the application scenarios of carbon fiber powder in electronic packaging.