转换器
模块化设计
块(置换群论)
电子工程
电感器
功率(物理)
放大器
计算机科学
接口(物质)
工程类
能量(信号处理)
压力(语言学)
推进
电气工程
压力测试
模块化(生物学)
电阻抗
拓扑(电路)
电流(流体)
作者
Seung-Yong Lee,Da-Yae Yoon,Donghwan Lee,Shenghui Cui,Sanghyun KIM,Jae-Jung Jung
标识
DOI:10.1007/s43236-026-01328-x
摘要
The double submodule (DSM), which integrates two series-connected half-bridges within a single submodule, has gained attention as a compact and space-efficient building block for the modular multilevel converters (MMCs) used in constrained environments such as urban power-conversion stations and electric ship propulsion systems. Reliable DSM operation must be verified under realistic loading conditions. However, existing submodule (SM) test approaches, including mission profile emulations (MPEs) and power-hardware-in-the-loop simulations (PHILS), are unsuitable for DSMs. When applied to DSMs, these approaches require a high-voltage power amplifier with an output capability exceeding twice the dc rating of an equivalent single SM, which significantly increases implementation complexity. This paper proposes a DSM-based loading-test method that eliminates the need for an auxiliary high-voltage power amplifier. Two DSMs are interconnected through an interface inductor to synthesize arm-current-shaped waveforms, while an auxiliary dc source compensates only the energy loss to sustain operation. Experimental results obtained from laboratory-scale DSM hardware demonstrate that the proposed method reproduces representative current stress, offering a practical and hardware-minimal solution for DSM loading tests.
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