Highly Bendable and Durable Transparent Electromagnetic Interference Shielding Film Prepared by Wet Sintering of Silver Nanowires

材料科学 电磁屏蔽 复合材料 透射率 相对湿度 氧化铟锡 光电子学 图层(电子) 石墨烯 纳米技术 物理 热力学
作者
Dong Gyu Kim,Jong Han Choi,Duck‐Kyun Choi,Sang Woo Kim
出处
期刊:ACS Applied Materials & Interfaces [American Chemical Society]
卷期号:10 (35): 29730-29740 被引量:111
标识
DOI:10.1021/acsami.8b07054
摘要

Electromagnetic (EM) wave emissions from wearable or flexible smart display devices can cause product malfunction and have a detrimental effect on human health. Therefore, EM shielding strategies are becoming increasingly necessary. Consequently, herein, we prepared a transparent acrylic polymer-coated/reduced graphene oxide/silver nanowire (Ag NW) (A/RGO/SANW) EM interference (EMI) shielding film via liquid-to-vapor pressure-assisted wet sintering. The film exhibited enhanced Ag NW network formation and antireflection (AR) effects. The wet-sintered Ag NW shielding film had a threshold radius of curvature (ROC) of 0.31 mm at a film thickness of 100 μm, demonstrating its high flexibility, whereas the conventional indium tin oxide (ITO) shielding film had a threshold ROC of ∼5 mm. The EMI shielding effectiveness (SE) of the A/RGO/SANW multilayer film was approximately twice that of the ITO film at a similar relative transmittance (84-85%). The optical relative reflectance of the Ag NW layer was reduced due to the AR effect, and the visible-light transmittance was considerably improved owing to the different refractive indices in the multilayer shielding film. Because the acrylic coating layer had a high contact angle, the multilayer film exhibited high temperature and humidity durability with little change in the SE over 500 h at 85 °C and 85% relative humidity. The multilayer film comprising wet-sintered Ag NW exhibited high flexibility and humidity durability, high shielding performance (more than 24 dB at a relative transmittance of 85% or more), and high mass productivity, making it highly applicable for use as a transparent shielding material for future flexible devices.
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