辐射
辐照
聚合物
紫外线
烧蚀
激光器
激发态
材料科学
激光烧蚀
可见光谱
光化学
波长
光子
热的
光解
光学
光电子学
原子物理学
化学
物理
复合材料
热力学
航空航天工程
核物理学
工程类
作者
Barbara J. Garrison,R. Srinivasan
标识
DOI:10.1364/msba.1985.mb4
摘要
There has been considerable interest recently in the use of laser radiation to remove material from a solid. Of particular interest is the observation that short pulses far-UV (e.g., 193 nm) radiation ablates organic polymers cleanly, i.e., the remaining sample exhibits a precisely defined pit (1-3). It is possible that the radiation could have melted or damaged the remaining sample. Indeed for longer wavelength radiation, e.g. visible light, damaged samples are generally observed (4). Obviously there are at least two distinct processes that can result in ablation of material when it is irradiated by laser light. In the following discussion we will refer to the phenomenon that cleanly etches the material as the photochemical process and the one that melts the sample as the thermal process. We have developed microscopic models for each of the two processes (5). In the photochemical model we assume one photon is directly responsible for dissociating one bond via a transition to an excited electronic state. In the thermal model we assume that the laser energy is absorbed into vibrational modes of the solid.
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