发光二极管
晶片切割
光学
材料科学
光电子学
激光器
薄脆饼
物理
作者
Meng-Chun Shen,Jinlan Chen,Ming-Chun Tseng,Shouqiang Lai,Zhening Zhang,Lijie Zheng,Su-Hui Lin,Kang-Wei Peng,Zhong Chen,Tingzhu Wu
出处
期刊:Optics Express
[The Optical Society]
日期:2024-04-17
卷期号:32 (11): 18508-18508
被引量:3
摘要
In this study, AlGaN-based deep-ultraviolet light-emitting diodes (DUV-LEDs) processed via standard laser dicing (SLD) and multifocal laser stealth dicing (MFLSD) were investigated. Adopting the MFLSD technology would generate a roughing surface rather than the V-shaped grooves on the sidewall of 508 × 508 µm 2 DUV-LEDs, which would reduce the forward operating voltage and increase the wall-plug efficiency, light output power, and far-field radiation patterns of these devices. In addition, the wavelength shift, far-field patterns, and light-tracing simulation results of the DUV-LEDs processed with SLD and MFLSD were clearly demonstrated and analyzed. Accordingly, it was observed that the MFLSD process provided more possibilities for photon escape to increase the light extraction efficiency (LEE) of DUV-LEDs, thus decreased the wavelength-redshift and junction temperature in DUV-LEDs. These results provide a reference for advanced nano-processing practices implemented during the fabrication of semiconductor devices.
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