磨合
可靠性工程
威布尔分布
可靠性(半导体)
过程(计算)
计算机科学
电路可靠性
加速寿命试验
工程类
电压
功率(物理)
电气工程
物理
操作系统
统计
量子力学
数学
作者
Mohd Fazli Zakaria,Z.A. Kassim,Melanie Po‐Leen Ooi,Serge Demidenko
出处
期刊:IEEE Design & Test of Computers
[Institute of Electrical and Electronics Engineers]
日期:2006-03-01
卷期号:23 (2): 88-98
被引量:45
摘要
To guarantee an industry standard of reliability in ICs, manufacturers incorporate special testing techniques into the circuit manufacturing process. For most electronic devices, the specific reliability required is quite high, often producing a lifespan of several years. Testing such devices for reliability under normal operating conditions would require a very long period of time to gather the data necessary for modeling the device's failure characteristics. Under this scenario, a device might become obsolete by the time the manufacturer could guarantee its reliability. High-voltage stress testing (HVST) is common in IC manufacturing, but publications comparing it with other test and burn-in methods are scarce. This article shows that the use of HVST can dramatically reduce the amount of required burn-in.
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