球栅阵列
晶圆级封装
电感器
晶圆规模集成
无线电频率
倒装芯片
电气工程
电子工程
Q系数
薄脆饼
集成电路封装
材料科学
模具(集成电路)
小尺寸
集成电路
工程类
电压
机械工程
焊接
胶粘剂
图层(电子)
谐振器
复合材料
作者
Christianto C. Liu,Shuo-Mao Chen,Feng Wei Kuo,Huan-Neng Chen,En-Hsiang Yeh,Cheng-chieh Hsieh,Li-Hsien Huang,Ming-Yen Chiu,John Yeh,Tsung-Shu Lin,Tzu-Jin Yeh,Shang-Yun Hou,Jui-Pin Hung,Jun Lin,Chewn-Pu Jou,Chuei-Tang Wang,Shin-Puu Jeng,Douglas W. Yu
出处
期刊:International Electron Devices Meeting
日期:2012-12-01
被引量:79
标识
DOI:10.1109/iedm.2012.6479039
摘要
Integrated fan-out wafer-level packaging (InFO-WLP) technology with state-of-the-art inductors (quality factor of 42 and self-resonance frequency of 16 GHz) has been demonstrated for heterogeneous integration of digital and radio frequency (RF) systems. InFO-WLP promises superior form factor, pin count, and thermal performance to existing flip-chip ball grid array (FC-BGA) packages. In addition, InFO-WLP's high Q inductors can enhance electrical performance and lower power consumption in RF circuit applications.
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