钝化
钙钛矿(结构)
材料科学
光电子学
带隙
载流子寿命
结晶
开路电压
化学工程
电压
纳米技术
硅
图层(电子)
电气工程
工程类
作者
Parnian Ferdowsi,Efrain Ochoa‐Martinez,Sandy Sanchez Alonso,Ullrich Steiner,Michael Saliba
标识
DOI:10.1038/s41598-020-79348-1
摘要
Abstract Wide band-gap perovskite solar cells have the potential for a relatively high output voltage and resilience in a degradation-inducing environment. Investigating the reasons why high voltages with adequate output power have not been realized yet is an underexplored part in perovskite research although it is of paramount interest for multijunction solar cells. One reason is interfacial carrier recombination that leads to reduced carrier lifetimes and voltage loss. To further improve the V oc of methylammonium lead tri-bromide (MAPbBr 3 ), that has a band-gap of 2.3 eV, interface passivation technique is an important strategy. Here we demonstrate two ultrathin passivation layers consisting of PCBM and PMMA, that can effectively passivate defects at the TiO 2 /perovskite and perovskite/spiro-OMeTAD interfaces, respectively. In addition, perovskite crystallization was investigated with the established anti-solvent method and the novel flash infrared annealing (FIRA) with and without passivation layers. These modifications significantly suppress interfacial recombination providing a pathway for improved V OC ’s from 1.27 to 1.41 V using anti solvent and from 1.12 to 1.36 V using FIRA. Furthermore, we obtained more stable devices through passivation after 140 h where the device retained 70% of the initial performance value.
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