计算机科学
超级计算机
计算机体系结构
操作系统
并行计算
嵌入式系统
作者
K. Fischer,Frank E. Abboud,R. Aggarwal,P. Amin,Satyajit Anand,M. Asoro,C. Atay,C. Auth,Muratahan Aykol,A. Badmaev,B. Bains,K. Beckwitt,John Bell,M. Bellah,Dhananjay Bhawe,J. Birdsall,William T. Blanton,James O. Bondi,Anupama Bowonder,James D. Brooks
标识
DOI:10.23919/vlsitechnologyandcir65189.2025.11075006
摘要
An advanced Intel 18A technology featuring RibbonFET and PowerVia provides over 30% density scaling and a full node of performance improvement compared to Intel 3. Intel 18A achieved 18%/25% performance (0.75V/1.1V) at iso-power over Intel 3 through an industry-first combination and optimization of advanced interconnects, a Gate-All-Around (GAA) transistor architecture, backside power, and design co-optimization. Intel 18A offers high-performance (HP) and high-density (HD) libraries with full-featured technology design capabilities and enhanced design ease of use.
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