钝化
材料科学
合金
介电谱
X射线光电子能谱
非阻塞I/O
氢氧化物
氧化物
氧化镍
电化学
图层(电子)
化学工程
冶金
无机化学
电极
复合材料
化学
催化作用
物理化学
工程类
生物化学
作者
Yue Li,Shuyan Zhao,Xinyu Zhang,Shuo Zhang,Xiaoliang Wu,Nianchu Wu
标识
DOI:10.17222/mit.2023.782
摘要
Passive films formed on a Cu-Ni alloy in various concentrations of alkaline environment were investigated by potentiodynamic polarization, electrochemical impedance spectroscopy (EIS), X-ray photoelectron spectroscopy and the Mott–Schottky approach. The wide passivation range of the copper-nickel alloy was tested in alkaline solutions of three concentrations. The oxide film on the specimen has a p-type semiconductor property, while the flat band potential (EFB) decreased with increasing solution concentration. The film resistance of the passive films increased with increasing solution concentration. The pAassive films showed a duplex structure, including an inner layer of oxide (Cu2O, NiO) and an outer layer of hydroxide (Cu(OH)2, Ni(OH)2).
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