聚酰亚胺
微电子
材料科学
反应离子刻蚀
蚀刻(微加工)
激光器
机械加工
各向同性腐蚀
光电子学
纳米技术
复合材料
图层(电子)
光学
冶金
物理
作者
P. A. Moskowitz,D. R. Vigliotti,R. J. von Gutfeld
出处
期刊:Conference on Lasers and Electro-Optics
日期:1983-01-01
卷期号:: FA1-FA1
标识
DOI:10.1364/cleo.1983.fa1
摘要
Polyimide materials are used in ever increasing quantity for electronics applications because of their temperature stability, flexibility, and chemical inertness. Because of this chemical inertness, modification processes demanding the subtraction of material generally require reactive ion etching or mechanical machining.
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