散热片
气流
绝缘栅双极晶体管
机械工程
空气冷却
鳍
流利
数码产品
传热
材料科学
大功率led的热管理
热阻
机械
核工程
工程类
电气工程
计算流体力学
电压
航空航天工程
物理
作者
Christian Bünnagel,Shafiul Monir,Andrew Sharp,Alecksey Anuchin,Olivier Durieux,Ikea Uria,Yuriy Vagapov
标识
DOI:10.1016/j.applthermaleng.2021.117560
摘要
The paper discusses an approach to the design of the forced air-cooling heat sink for power electronic application to uniformly distribute the temperature of the semiconductor modules fixed on the top of the heat sink. The proposed approach suggests a minor modification of a conventional fin-based heat sink commonly manufactured for cooling of power electronic modules. Following the proposed modification, an air guide plate having a V-shaped cut is attached to the bottom of the heat sink to redistribute the airflow through the fins. To verify the proposed approach, the modified forced air-cooling system for a power electronic circuit comprising of three IGBT modules was modelled and numerically simulated using Ansys Fluent software under steady-state conditions. The numerical analysis was conducted for a range of power loss 50–100 W in each IGBT module and an airspeed of 5 m/s through the heat sink. The simulation results have shown a good uniform distribution of the temperature across the IGBT modules where the temperature difference does not exceed 0.21 °C.
科研通智能强力驱动
Strongly Powered by AbleSci AI