C. Constancias,S. Landis,S. Manakli,Luc Martin,Laurent Pain,David del Rio
标识
DOI：10.1002/9781118557662.ch3
摘要
This chapter contains sections titled: Introduction Different equipment, its operation and limits: current and future solutions Maskless photolithography Alignment Electron-sensitive resists Electron–matter interaction Physical effect of electronic bombardment in the target Physical limitations of e-beam lithography Electrons energy loss mechanisms Database preparation E-beam lithography equipment E-beam resist process Bibliography
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(2025-6-4)
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