High-Density Wafer Level Connectivity Using Frontside Hybrid Bonding at 250nm Pitch and Backside Through-Dielectric Vias at 120nm Pitch After Extreme Wafer Thinning
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材料科学
光电子学
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电介质
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生态学
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作者
Liesbeth Witters,Stefaan Van Huylenbroeck,San Chun Kang,Peng Zhao,S-A. Chew,Koen D’havé,Serena Iacovo,Michele Stucchi,Baowei Zhang,Sarah Dewilde,D. Montero,Rami Chukka,K. Vandersmissen,N. Heylen,N. Jourdan,Jan Willem Maes,H. Bana,C. Zhu,Joeri De Vos,Gerald Beyer
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(2025-6-4)
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