Multilayered graphene fluoride and Ti3C2Tx MXene-based aramid nanofiber films with excellent thermal conductivity and electromagnetic interference shielding performance

材料科学 电磁屏蔽 电磁干扰 热导率 石墨烯 芳纶 电磁干扰 复合材料 纳米纤维 光电子学 热稳定性 导电体 纳米技术 电气工程 纤维 化学工程 工程类
作者
Jun‐Beom Kim,Minh Canh Vu,Bong Kuk Seo,Dineshkumar Mani,S. Anand,Tae‐Hyeong Jeong,Sung‐Ryong Kim
出处
期刊:Colloids and Surfaces A: Physicochemical and Engineering Aspects [Elsevier]
卷期号:: 133121-133121 被引量:19
标识
DOI:10.1016/j.colsurfa.2023.133121
摘要

Thermally conductive electromagnetic interference (EMI) shielding materials with excellent thermal conductivity, EMI shielding effectiveness (SE), and electrical insulation are pivotal for ensuring the operation and performance of next-generation electronic devices, safeguarding them against external electromagnetic waves and mitigating excessive heat generation. In this study, multilayered graphene fluoride (GF) and Ti3C2Tx MXene (MX)-based aramid nanofiber (ANF) films, in which the MX@ANF layer was sandwiched between GF@ANF layers, were fabricated using the alternating vacuum filtration method. The resultant multilayered films with increased GF and MX contents showed an upsurge in thermal conductivity and EMI SE while maintaining excellent electrical insulation, thermal stability, and mechanical flexibility. The GF50/MX75 film with 50 wt% GF content and 75 wt% MX content in each layer exhibited an excellent EMI SE of ∼41 dB in the X-band frequency, along with a superior specific shielding effectiveness of 3818 dB·cm2/g, an outstanding in-plane thermal conductivity of 85 W/m·K, and mechanical strength of 70 MPa. The notable properties of the GF/MX films are attributed to the well-ordered alignment of the GF and MX sheets and their strong interaction with ANF, which facilitates phonon and electron conduction. Furthermore, the multilayered GF/MX films exhibited excellent heat dissipation capabilities and flame retardancy. Owing to their exceptional performance, multilayered GF/MX films offer a compelling opportunity to advance EMI shielding and thermal management materials to the forefront of next-generation electronics.
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