过程(计算)
计算机科学
过程控制
控制(管理)
半导体器件制造
先进过程控制
在制品
工作(物理)
系统工程
制造工程
工程类
电气工程
机械工程
操作系统
人工智能
运营管理
薄脆饼
作者
Yun Jung Jee,Sang Hyun Han,Shay Wolfling
标识
DOI:10.1109/edtm55494.2023.10103045
摘要
We report on the challenges of process control for advanced semiconductor devices and comprehensive solutions to overcome them. The challenges arise in the environment of 3D structures and process complexity where pitch decreases and aspect ratio increases at advanced technology nodes. In this work we will summarize how various strategies, including the Lab to Fab conversion of new source technology, are being implemented through several cases. We will also outline the need for further improvement.
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