Survey on 3D-ICs thermal modeling, analysis, and management techniques

Thermal management is one of the important issues of 3D IC integration. So, effective thermal management methodologies and solutions are needed for widespread use of 3D IC integration. The thermal analysis is an important as from the thermal and stress distribution, layout modification can be done and thus enhance the circuit reliability. The thermal issue of a 3D IC is much severer than that of a 2D IC. The cause is that the ambient environment of the die of a 2D IC is the cooling material, but the ambient environment of a die within a 3D IC may be another die that also generates heat. Therefore, Thermal management in 3D ICs is critical for maintaining required reliability, performance, and power dissipation target. Therefore, new cooling techniques must be innovated to ensure that the chip can operate at temperatures and performance required for reliability. This paper presents a survey on 3D-ICs modeling, analysis, and management techniques.