Innovative Approach on Dynamic Behavior of LPCVD Nitride Process on Diffusion Furnace : Equipment Optimization/Advanced Process Control/Contamination Free Manufacturing

Nitride film LPCVD (Low Pressure Chemical Vapor Deposition) process is well known in semiconductor industry. The paper covers an innovative approach in touching two aspects of improvement in LPCVD nitride process in diffusion furnace. First is the extension of quartz life use by implementation of unique LTP (Low Temperature Purge) without affecting particle performance. Secondly, the impact of extended quartz life on the wafer uniformity across the different zones and methodology to compensate it.