材料科学
热导率
弹性体
电子设备和系统的热管理
柔性电子器件
复合材料
数码产品
可伸缩电子设备
散热膏
热的
纳米尺度
保温
纳米技术
延伸率
导电体
腐蚀
铜
极限抗拉强度
碳纳米管
机械工程
接口(物质)
作者
Daisuke Kuse,Yudai Kaneko,Ryohei Fujita,Tatsuhiro Horii,Daishi Shiojiri,Yuta Ozawa,Kyohei Nagatake,Tamami Takano,Yutaka Isoda,Aoi Koishikawa,Takashi Goto,Ai Ueno,Shoji Maruo,Kazuhide Ueno,Toshinori Fujie,Hosei Nagano,Hiroki Ota
标识
DOI:10.1002/adfm.202527281
摘要
ABSTRACT Efficient thermal management in stretchable electronics demands materials that seamlessly integrate high thermal conductivity, mechanical flexibility, and reliable interface stability. This paper presents a stretchable, thermally conductive, biphasic, liquid‐metal sheet (LM sheet)—formed by dispersing copper particles in gallium‐based liquid metal—encapsulated between nanoscale styrene–butadiene–styrene elastomer layers. This trilayer architecture establishes continuous thermal‐conduction pathways while providing excellent electrical insulation and corrosion resistance. The LM sheet achieves impressive in‐plane and through‐plane thermal conductivities (40.4 and 16.7 W m −1 K −1 , respectively), with an elongation at break >200%. Notably, it retains 96% of its thermal conductivity even under 100% tensile strain. It adheres strongly to various substrates without adhesives, excellently spreading heat in flexible heaters and stretchable LED devices under both static and stretched conditions. This paper presents a compelling strategy for developing next‐generation thermal‐interface materials for deformable and skin‐integrated electronic systems.
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