Effect of Electronic Components Placements on Temperatures Field for PCB during Reflow Soldering

Based on the processes of reflow soldering for lead-free solder,four FEA models with different placements of electronic components were established to a printed circuit board.By using of Ansys,the processes of reflow soldering with different placements were simulated,and the thermal fields of all these models were analyzed.The results indicate that the distribution of temperatures would be different in the four samples.With the electronic components sit in four corners of the PCB,the highest temperatures of the soldering paste and BGA would be rise.The highest temperatures of soldering paste would be cut down,if the components were sit in cross-shaped,and decreasing the transverse spacing distance between the electronic components with limits,the effect on PCB for reflow soldering were not obvious.