Electroless gold plating technics in electronic plating industry in Japan—part one

The paper is to be published in two parts, introducing the electroless gold plating process in electronic plating industry in Japan. In the first part, the composition and reaction mechanism of two bath systems of potassium borohydride and DMAB used in the early period were discussed. Problems existing in the two bath system were presented. Eight kinds of measures improving electroless gold plating rate were suggested.