Equilibrium Elasto-Hydrodynamic Analysis in Wafer Slicing Process Using Wiresaw

Abstract An improved elasto-hydrodynamic (EHD) model of wiresaw slicing process is summarized in this paper which incorporates the equation of equilibrium for the motion of the wire. Parametric studies are conducted, which encompass different cases in the wiresaw slicing process. Based on the results, we examine the effects of wire bow angle on the EHD properties and the slicing mechanism of wiresaw process. The simulation results provide insights to the wiresaw slicing mechanism, and suggest ways to facilitate the experimental study for industry wiresaw slicing.