Thermally enhanced flip-chip BGA with organic substrate

A thermally enhanced Flip-chip BGA package (FC-BGA) with organic substrate has been developed. The package is proud of the high thermal and electrical performance due to the flip-chip interconnections, and the optimized heat spreader attached directly on to the die. Besides, the eutectic solder bumps (Pb63wt% Sn) have realized high reliability of flip-chip interconnections, compared with the high melting point solder bumps (Pb-3wt% Sn connected with Pb-63wt% Sn).