材料科学
绝缘栅双极晶体管
MOSFET
光电子学
击穿电压
GSM演进的增强数据速率
电压
碳化硅
功率半导体器件
电气工程
晶体管
复合材料
计算机科学
工程类
电信
作者
Keiji Wãda,Hideto Tamaso,Satomi Itoh,Kenji Kanbara,Toru Hiyoshi,Shigenori Toyoshima,Jun Genba,Hitoki Tokuda,Takahiro Sugimura,Hisato Michikoshi,Takashi Tsuno,Yasuki Mikamura
出处
期刊:Materials Science Forum
日期:2015-06-30
卷期号:821-823: 592-595
被引量:4
标识
DOI:10.4028/www.scientific.net/msf.821-823.592
摘要
Characteristics of SiC MOSFETs and SBDs with 3.3 kV-class have been presented. Static Characteristics of the MOSFET showed a specific on-resistance of 14.2 mΩ cm 2 . A breakdown voltage of 3850 V is obtained by using the dose optimized edge termination structure as we have previously reported [1]. At the same time, reverse leakage current of the 3.3 kV SiC SBDs can be suppressed by the JBS structure and the edge termination which is also used in the MOSFETs. By using the MOSFETs and SBDs, we have demonstrated the superior capability of the 3.3 kV 400 A full SiC 2 in 1 modules with a compatible case and terminal configurations to Si IGBT modules. Dynamic characteristics of the full SiC module in an inductive load switching exhibits superior turn-on and turn-off properties even at a high drain voltage of 1650 V, demonstrating the availability of high voltage SiC power systems.
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