薄脆饼
晶体管
材料科学
硅
磁道(磁盘驱动器)
电气工程
光电子学
还原(数学)
电子工程
节点(物理)
工程类
机械工程
电压
结构工程
几何学
数学
作者
Syed Muhammad Yasser Sherazi,Jung Kyu Chae,Peter Debacker,L. Matti,Diederik Verkest,A. Mocuta,Ryoung-Han R. Kim,A. Spessot,Amit Dounde,Julien Ryckaert
摘要
Advanced technology nodes are based on nFET and pFET fins, which are fabricated on the same Silicon level of the wafer. However, in a complimentary FET (CFET) technology the nFET and pFET devices are stacked on top of each other [1]. This provides a significant area reduction mainly driven by a simplified transistor terminal access and the removal of the lateral physical separation between the two transistors. The combination of the CFET with buried power rails can reduce the track height of the cells and the elusive 3 Track standard cell is seen to be a possibility.
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