P‐115: Research on Waviness Improvement for Foldable Display and Relevant Ultra‐Thin Metal Plate Modeling Process

Since the creep was an inherent characteristic of polymer materials, the all‐polymer Organic Light‐Emitting Diode (OLED) display module exhibited a permanent deformation that could not be recovered by itself. We hoped to use ultra‐thin metal plate as a support to reduce the irreversible module waviness. However, there would be a risk of crack failure causing by the stress concentration at the metal edges of the folding area. After researching among three conventional metal cutting methods (punch, etch and laser‐cut), we compared the morphologies of the cutting edges and found that the punch process was optimal for ultra‐thin metal plate cutting.