Calibration of a piezoresistive stress sensor in [100] silicon test chips

In this paper, we report the experimental results for calibration of a 2D piezoresistive stress sensor using a four-point bending fixture. The sensor on the [100] test chips was able to accurately measure plane stress components in a temperature compensated manner. The resistance of stress sensors was found to vary linearly with the applied stress. The piezoresistive coefficient was calculated and found to coincide with the reported values for silicon. A further study of the thermally induced stresses was also carried out to determine the resistance change that varied linearly with temperature.