Low Power Microwave Plasma Spraying for Low Resistivity Cu Deposition Onto Resin Substrate

Abstract In this study, copper coatings are deposited on polyacetal substrates by low-power microwave plasma spraying and the coating formation mechanism is investigated. In the initial formation of the coating, molten copper particles are embedded on the substrate, creating conditions for excellent bonding as confirmed by adhesion strength measurements exceeding 40 MPa. The study also shows that adding hydrogen to the argon working gas improves oxide reduction, resulting in copper coatings with volume resistivity as low as 0.049 µΩm.