Advanced Insulation Materials for Next Generation Packaging Technology

Build-up process is a highly effective for high-density integration of printed circuit boards. Ajinomoto Build-up Film® (ABF™)* ^{1 1} “Ajinomoto Build-up Film” is registered trademark in Japan, South Korea, United States and other countries. ® denote registered trademark in Japan. “ABF” is trademark. has become world-wide used insulation build-up material for manufacturing IC package substrates with Semi-Additive Process (SAP) because of their good resin flowability, insulation reliability, thickness uniformity, and SAP applicability. As the recent growth of new thinner and fine pattern packaging technology, such as 2.1D/Fan-Out (FO) type packaging technologies, we developed small-sized filler loaded ABF (Nano filler ABF) as a redistribution layer material and LE series as a film type molding compound. Using Nano filler ABF, we demonstrated 2/2 micrometers line and space Cu patterning and diameter 5 micrometers laser via for interlayer connection. LE performed quite low warpage on both of 12-inch wafer and large size panel owing to low CTE, low Young's modulus, high Tg, and consisting of special polymer.