13.1: The design and preparation of flexible MiniLED plate with nano‐Ag paste

The development and preparation process of a flexible MiniLED line subgrade board on a white reflective sheet was carried out in this paper using silk‐printing nanoscale silver paste assisted bonding technology. The design of the line conductivity parameter ‐ nanoscale silver paste parameter model, printing plate selection, and process verification were systematically completed, as well as the preparation and reliability confirmation of flexible MiniLED lamp board. The flexible MiniLED lamp board with disposable sintered nano silver slurry lines was successfully prepared, and the 65" backlight module was constructed.