Chemical Mechanical Planarization of Microelectronic Materials
作者
Joseph M. Steigerwald,S. P. Murarka,R.J. Gutmann
标识
DOI：10.1002/9783527617746
摘要
Historical perspective CMP: variables and manipulations electrochemical and mechanical concepts for CMP processes copper CMP CMP of other materials post CMP cleaning.
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(2025-6-4)
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