Development of a 1000-pin fine-pitch BGA for high performance LSI

A 1000-pin fine-pitch BGA has been developed by using a 50-/spl mu/m ultra fine pitch wire bonding technique. This package can be mounted with a chip with dimensions ranging from 14 mm/spl times/14 mm to 16 mm/spl times/16 mm. This package also has signal lines that have an embedded microstrip line structure. Also it has a package size heat spreader, which means that the electrical characteristics are such that the package can be applied to an LSI operating at a frequency of about 800 MHz. The thermal characteristics are such that the package can be applied to 10 W devices without the need for a fin. Furthermore, this BGA package has been confirmed to be sufficiently reliable.