光电子学
材料科学
薄脆饼
基质(水族馆)
发射机
分路器
氮化镓
炸薯条
硅
兴奋剂
功率消耗
电子工程
计算机科学
功率(物理)
纳米技术
电信
光学
工程类
物理
地质学
频道(广播)
海洋学
图层(电子)
量子力学
作者
Hao Zhang,Jiabin Yan,Ziqi Ye,Fan Shi,Jinlong Piao,Wei Wang,Xumin Gao,Hongbo Zhu,Yongjin Wang,Yuhuai Liu,Hiroshi Amano
摘要
GaN-based devices have grown rapidly in recent decades, due to their important research value and application prospects. There is a desire to monolithically integrate different GaN devices into a single chip for the development of future optoelectronic systems with low power consumption. In addition to improved multifunctional performance, a miniature integrated system can result in a significant reduction in material costs, processing costs, and packaging costs. In view of such prospects, we propose monolithic, top-down approaches to build III-nitride transmitter, modulator, waveguide, beam splitter, receiver, and monitor as a single unit onto a conventional GaN-on-silicon wafer without involving regrowth or postgrowth doping. Data communication among these components is realized through light propagation, opening up horizons for GaN optoelectronic systems on a chip.
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