错配
材料科学
光电子学
氮化镓
逻辑门
阈下传导
和大门
金属浇口
阈下斜率
晶体管
阈值电压
场效应晶体管
电子工程
电气工程
电压
栅氧化层
纳米技术
工程类
图层(电子)
作者
HaoChen Wang,Kuangli Chen,Ning Yang,Jianggen Zhu,Enchuan Duan,ShuTing Huang,Zhao Yishang,Bo Zhang,Qi Zhou
出处
期刊:Electronics
[MDPI AG]
日期:2024-02-10
卷期号:13 (4): 729-729
被引量:1
标识
DOI:10.3390/electronics13040729
摘要
In this work, a novel enhancement-mode GaN p-MISFET with a buried back gate (BBG) is proposed to improve the gate-to-channel modulation capability of a high drain current. By using the p-GaN/AlN/AlGaN/AlN double heterostructure, the buried 2DEG channel is tailored and connected to the top metal gate, which acts as a local back gate. Benefiting from the dual-gate structure (i.e., top metal gate and 2DEG BBG), the drain current of the p-MISFET is significantly improved from −2.1 (in the conv. device) to −9.1 mA/mm (in the BBG device). Moreover, the dual-gate design also bodes well for the gate to p-channel control; the subthreshold slope (SS) is substantially reduced from 148 to ~60 mV/dec, and such a low SS can be sustained for more than 3 decades. The back gate effect and the inherent hole compensation mechanism of the dual-gate structure are thoroughly studied by TCAD simulation, revealing their profound impact on enhancing the subthreshold and on-state characteristics in the BBG p-MISFET. Furthermore, the decent device performance of the proposed BBG p-MISFET is projected to the complementary logic inverters by mixed-mode simulation, showcasing excellent voltage transfer characteristics (VTCs) and dynamic switching behavior. The proposed BBG p-MISFET is promising for developing GaN-on-Si monolithically integrated complementary logic and power devices for high efficiency and compact GaN power IC.
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