Laser Transfer, Printing, and Assembly Techniques for Flexible Electronics

Abstract It is challenging to manufacture large‐area, ultrathin, flexible/stretchable electronics on an industrial scale. Recent ground‐breaking advances in the manufacture of flexible electronics are based on powerful laser processes. Laser irradiation at an internally absorbing interface through a transparent substrate will bring various physical changes and chemical reactions at the interface, accompanied by distinct phenomena. Numerous techniques derived from these phenomena with the unique ability to fabricate materials, structures, and devices on flexible substrates with the advantages of noncontacting processing, high efficiency, adjustable coverage from micro‐ to macroscale, and compatibility with organic and inorganic materials have been developed. The latest impressive progress in these laser‐based techniques for the production of flexible electronics is reviewed, and the key developments in laser lift‐off, laser‐assisted printing, and laser‐assisted transfer printing techniques are highlighted. The fundamental principles of these techniques are discussed along with their basic mechanisms, followed by an exploration of the latest progress and future prospects in the field. The unique features of these techniques and state‐of‐the‐art applications related to flexible electronics are also highlighted. Finally, the challenges and future prospects of these techniques are explored, from the essential mechanics, engineering efforts, and novel approaches, to comprehensive combinations with innovative fabrication concepts and device structures.