Intelligent prediction technology research of wire wedge bonding quality for millimeter wave IC

Aiming at the process optimization problem of wire wedge bonding for millimeter wave IC,a improved BP(Back propagation) neural network algorithm with penalty function used in the intelligent prediction of wire wedge bonding quality was presented.The key process parameters influencing on the wedge bonding quality were analyzed by experimentation,the evaluation index of quality for wire wedge bonding was established.Based on the improved BP neural network,the intelligent predictable model of wire wedge bonding quality was established.The research results show that the improved BP neural network algorithm is rational,and it can effectively predict the influence disciplinarian of process parameters on wedge bonding quality.