Enhancing thermal capabilities of component packaging

Heat transfer from a component to the ambient can be optimized, primarily by reducing the thermal resistance from the main source of heat to the ambient. At package level, reducing thermal resistance can be achieved through adding embedded thermal pads into the package, increasing the number of vias in the package's substrate, and using materials with high thermal capabilities. The research presented in this paper aims to bring further optimizations to component packaging, by showing that making the proper electrical connection inside the IC package can bring improvements to the thermal blueprint of the electronic system.